PCB COPPER PLATING MACHINE

Specifications:

  1. Copper platingmachine process includes: Loading → Acid cleaner → Rinse1/2 → Micro etch → Rinse1/2 → Acid dip → Copper plating → Rinse1/2 → Acid dip → Tin plating → Rinse1/2 → Rack stripping → Rinse1/2 → Hot dryer →
  2. Dimension: L15,160xW2750xH4000MM
  3. Tanks dimension: L1800xW860xH1180 mm
  4. Copper heating/cooling: Electric heating with cooling coil
  5. Copper process time: 60-75minuts
  6. Total power consumption: 95KW
  7. Guarantee: 1year
  8. Optional: Rectifier, Filter, Auto regeneration system; Cooling chiller; waste gas scrubber(acid fume treatment)

 

 

+8615895086578

Mobile

sales@ty-cz.com

E-mail

Description

CB Pattern Copper plating machine

 

PCB copper plating machine is waiting for you.

 

PCB copper plating machine is suitable for both first copper (via filling) and pattern copper plating processes(surface build-up). It is an automated line that uses electrolytic copper baths, rectifiers, filters, and agitation systems to deposit uniform copper layers on PCB surfaces and through holes.

Machine Construction:

  1. Frame: Made of SS 304 stainless steel for strength and corrosion resistance.
  2. Tanks: PP material (12mm/15mm/20mmthick) with tube reinforcement for extra durability.
  3. Oscillation System: Ensures even processing and better chemical exchange.
  4. Air Agitation System: Provides uniform solution circulation and stable operation.
  5. Transport System: Twoset PLC-controlled transporters for precise and automatic movement.