PCB ELECTOLESS COPPER PLATING MACHINE
Specifications:
- Copper platingmachine process includes: Loading → Degreasing → Rinse1/2 → Micro etch → Rinse1/2 → Acid dip → Rinse1/2 → Activation → Electroless copper → Rinse1/2 → Hot dryer →
- Dimension: L18,160xW2750xH4000MM
- Tanks dimension: L1500xW860xH1180 mm
- Copper heating/cooling: Electric heating with cooling coil
- Copper process time: 20-45minuts
- Total power consumption: 105KW
- Guarantee: 1year
- Optional: Filter, Auto regeneration system; Cooling chiller; waste gas scrubber(acid fume treatment)
+8615895086578
Mobile
sales@ty-cz.com
Description
PCB electroless copper plating machine
PCB copper plating machine is waiting for you.
Electroless copper plating machine is suitable for non-conductive surface activation and initial conductive layer deposition in PCB manufacturing, enabling reliable through-hole metallization before electrolytic copper processes. It is an automated chemical plating line that uses catalytic activation tanks, chemical copper baths, filtration, heating, and circulation systems to deposit uniform copper layers on PCB surfaces and through holes without external electrical power.
Machine Construction:
- Frame: Made of SS 304 stainless steel for strength and corrosion resistance.
- Tanks: PP material (12mm/15mm/20mmthick) with tube reinforcement for extra durability.
- Oscillation System: Ensures even processing and better chemical exchange.
- Air Agitation System: Provides uniform solution circulation and stable operation.
- Transport System: Twoset PLC-controlled transporters for precise and automatic movement.
